IMC Pillar Dispersed Lead-free Solder Joint
نویسندگان
چکیده
منابع مشابه
Lead-free Solder Joint Quality Investigation
New Pb-free materials ask thorough verification because their properties as wetting, solderability and mechanical properties are different from these SnPb. In this paper are presented some new facts from creep and stress relaxation investigation including new arrangement for measurement. Results from creep, stress, shear and bend testing are presented for three types of solder (Sn/3.5Ag, Sn/3.8...
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Until non-lead solder conversion is mature, the evaluation of materials and components is likely to identify trade-offs. The performance of the no-clean andwater-soluble solder pastes that were tested varied widely. Ultimately each company will need to determine which attributes are most important for their product line. Also components needed for a product may not be currently available as lea...
متن کاملInfluence of Thermomigration on Lead-Free Solder Joint Mechanical Properties
Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000°C /cm thermal gradient (TG) for 286 h, 712 h, and 1156 h. It was observed that samples subjected to thermal gradient did not develop a Cu3Sn inter...
متن کاملInvestigation of the Lead-free Solder Joint Shear Performance
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The purpose of this study is to investigate the effects of reflow profile and thermal shock on the shear performance of eutectic SnPb (SnPb) and Sn3.0Ag0.5Cu (SAC305) solder joints. Test boards were assembled with four different sized surface mount chip resisto...
متن کاملSolder Creep-Fatigue Model Parameters for SAC & SnAg Lead-Free Solder Joint Reliability Estimation
For many of the Pb-free solders required under the European RoHS directive, there is now sufficient information, primarily in the form of the results of accelerated thermal cycling of various levels of severity, to develop acceleration models for the creep-fatigue of these solders. In this paper the parameters for the SAC405/305, SAC205, SAC105 and SnAg to replace the parameters for eutectic Sn...
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ژورنال
عنوان ژورنال: Journal of Smart Processing
سال: 2016
ISSN: 2186-702X,2187-1337
DOI: 10.7791/jspmee.5.309